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 [ Flip chip bonding ] matched
4 Result(s)
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| No. |
Title |
Pub. Date |
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4 |
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| Novel Bumping Material for Solder-on-Pad Technology |
| Kwang-Seong Choi, Sun-Woo Chu, Jong-Jin Lee, Ki-Jun Sung, Hyun-Cheol Bae, Byeong-Ok Lim, Jong-Tae M ..., ETRI Journal, vol.33, no.4, Aug. 2011, pp 637-640 |
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Aug. 2011 |
3 |
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Dec. 2010 |
2 |
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| Thermal Characteristics of a Laser Diode Integrated on a Silica-Terraced PLC Platform |
| Duk-Jun Kim, Young-Tak Han, Yoon-Jung Park, Sang-Ho Park, Jang-Uk Shin, and Hee-Kyung Sung, ETRI Journal, vol.27, no.03, June 2005, pp 337-340 |
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June 2005 |
1 |
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Feb. 2004 |
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