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Chip Impedance Evaluation Method for UHF RFID Transponder ICs over Absorbed Input Power
Jeenmo Yang, and Junho Yeo
Abstract :	Based on a de-embedding technique, a new method is proposed which is capable of evaluating chip impedance behavior over absorbed power in flip-chip bonded UHF radio frequency identification transponder ICs. For the de-embedding, four compact co-planar test fixtures, an equivalent circuit for the fixtures, and a parameter extraction procedure for the circuit are developed. The fixtures are designed such that the chip can absorb as much power as possible from a power source without radiating appreciable power. Experimental results show that the proposed modeling method is accurate and produces reliable chip impedance values related with absorbed power.
Key word :	RFID tag chip impedance, chip impedance modeling, de-embedding technique.
DOI :	http://dx.doi.org/10.4218/etrij.10.0210.0208
Cite this :	Jeenmo Yang, and Junho Yeo, "Chip Impedance Evaluation Method for UHF RFID Transponder ICs over Absorbed Input Power," ETRI Journal, vol. 32, no. 6, Dec. 2010, pp. 969-971. http://dx.doi.org/10.4218/etrij.10.0210.0208
References :	1. Z. Xie, "Extracting True PA Input Impedance for High-Power RF Signals," RF Desisgn, Nov. 2007, pp. 26-29. 2. P.V. Nikitin et al., "Sensitivity and Impedance Measurements of UHF RFID Chips," IEEE Trans. Microw. Theory Tech., vol. 37, no. 5, May 2009, pp. 1297-1301. 3. A. Issaoun et al., "On the Deembedding Issue of CMOS Multigigahertz Measurements," IEEE Trans. Microw. Theory Tech., vol. 55, no. 9, Sept. 2007, pp. 1813-1823. 4. PNAHelp Home. Available at: http://na.tm.agilent.com/pna/help
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